HOSSFELD, Michael; CHU, Weiyi; ADAMECK, Markus; EICH, Manfred. Fast 3D-Vision System to Classify Metallic Coins by their Embossed Topography. ELCVIA Electronic Letters on Computer Vision and Image Analysis, Cerdayola del Vallès, Spain, v. 5, n. 4, p. 47–63, 2006. DOI: 10.5565/rev/elcvia.117. Disponível em: https://elcvia.cvc.uab.cat/article/view/v5-n4-hossfeld-chu-adameck-et-al. Acesso em: 5 jun. 2025.